8% of survey complete.
The International Electronics Manufacturing Initiative (iNEMI) is organizing a cooperative program to demonstrate expanded-beam single-mode fiber optic array connectors suitable for connections to photonic integrated circuit (PIC) modules. This program is the second phase of a more extended program, the first phase of which successfully demonstrated single-mode expanded-beam connectors for backplane and front panel applications.

To best tailor the second phase to demonstrate capabilities important to potential PIC manufacturers and users, iNEMI is soliciting industry input on the needed performance and other characteristics of the PIC module optical connector interface. To this end, we would very much appreciate your participation in this survey. It should take approximately 10-15 minutes to complete.

If your organization is focused on a single application of PICs, we would appreciate a single response reflecting your organization's consensus view regarding requirements. If your organization is pursuing multiple applications with significantly different requirements, we would appreciate separate responses reflecting each application.

You may answer anonymously or provide your contact information. We respect the information you provide and it will only be used for defining future iNEMI photonics activities. Only aggregated data will be made public. Individual responses will only be reviewed by iNEMI staff and the project leaders (Terry Smith, 3M; Tom Marrapode, Molex; Sean Foley, AFT; Peter O'Brien, Tyndall; and Tom Brown, Rochester University).

All respondents who share their contact information will receive an invitation to a webinar summarizing the survey results.

Thank you in advance for taking time to contribute to this program.