TIA 2023 Policy Forum Scholarship |
TIA 2023 Scholarship Application
TIA is offering five (5) Policy Forum scholarships, sponsored by Tai Software, to the TIA 2023 Policy Forum in Washington, DC, taking place September 25-27, 2003. Scholarships cover registration and a travel stipend. The TIA Policy Committee will make final selections.
Each company is limited to one (1) candidate. Candidates must be first-time TIA Policy Forum attendees and have a minimum of 2 years of experience in the 3rd party logistics industry.
Applications must be received on or before 11:45 pm EST, August 15, 2023, for consideration. Scholarship recipients will be notified by August 28, 2023, and provided with the necessary information for redeeming their scholarship. All recipients must agree to attend the Policy Forum beginning with the TIA Advocacy/TIAPAC Dinner on September 25 through the Policy Forum Dinner on September 26, and submit a written summary after attending the Policy Forum summarizing their experience and explaining how they believe their attendance will benefit them and further their career goals.
Each company is limited to one (1) candidate. Candidates must be first-time TIA Policy Forum attendees and have a minimum of 2 years of experience in the 3rd party logistics industry.
Applications must be received on or before 11:45 pm EST, August 15, 2023, for consideration. Scholarship recipients will be notified by August 28, 2023, and provided with the necessary information for redeeming their scholarship. All recipients must agree to attend the Policy Forum beginning with the TIA Advocacy/TIAPAC Dinner on September 25 through the Policy Forum Dinner on September 26, and submit a written summary after attending the Policy Forum summarizing their experience and explaining how they believe their attendance will benefit them and further their career goals.