DesignCon’s “Engineer of the Year” Award is given out each year during the DesignCon event. The award seeks to recognize the best of the best in engineering and new product advancements at the chip, board, or system level, with a special emphasis on signal integrity and power integrity.

The four finalists for the 2019 Engineer of the Year Award are listed below.

Please vote for the one person who you feel shows the most outstanding leadership, creativity, and out-of-the-box thinking brought to design/test of chips, boards, or systems, with particular attention paid to areas of signal and power integrity.

Each person can vote once. Voting will run through December 28, 2018, ending at noon Eastern. 

The winner will be announced at DesignCon, January 29-31, 2019, at the Santa Clara Convention Center, Santa Clara, CA. and provided with a $1,000 grant or scholarship to present to the educational institution of his or her choice.

Please click here to learn more about the finalists.

Please click here to learn more about DesignCon and register to attend!

See the Official Rules of the Engineer of the Year Award.

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* 1. Please vote for the finalist who you feel should be the DesignCon 2019 Engineer of the Year

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* 2. What company are you currently employed by?

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