Nomination Deadline: December 3, 2018

DesignCon’s “Engineer of the Year” Award is given out each year during the DesignCon event. The award seeks to recognize the best of the best in engineering and new product advancements at the chip, board, or system level, with a special emphasis on signal integrity and power integrity.

The winner will be selected based on his or her leadership, creativity, and out-of-the-box thinking brought to design/test of chips, boards, or systems, with particular attention paid to areas of signal and power integrity. The winner is provided with a $1,000 grant or scholarship to the educational institution of his or her choice.
 
Nominees must be active members of the DesignCon community to be considered for this award.

Please complete this form before the December 3, 2018, deadline to nominate an engineer who you feel embodies the qualifications mentioned above to be the DesignCon 2019 Engineer of the Year.

Learn more about this award.

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* 1. Nominator’s name

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* 2. Nominator’s title

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* 3. Nominator’s company

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* 4. Nominator’s email address

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* 5. Nominee’s name

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* 6. Nominee’s title

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* 7. Nominee’s company

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* 8. Nominee’s email address

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* 9. Reasons that the nominee should be considered to be the DesignCon 2019 Engineer of the Year. Please provide details showing his or her leadership, creativity, and out-of-the-box thinking brought to design/test of chips, boards, or systems, with particular attention paid to areas of signal and power integrity.

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* 10. If available, please list industry organizations, educational programs, and other related programs of which the nominee is a member. Please provide organization/program name, years of service, and accomplishments as appropriate.

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