Question Title

* TC1 Memory Repair for High Fault Rates
P. Papavramidou, TIMA, Grenoble

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* TC2 Output Bit Selection Methodology for Test Response Compaction
W-C. Lien, National Cheng Kung University

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* TC3  Testing of Interposer-based 2.5D Integrated  Circuits
R. Wang, Duke University

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