We greatly appreciate you taking the time to share your thoughts.
The PCB Market Catalyst is an effort being undertaken by the U.S. Partnership for Assured Electronics (USPAE) to address the lack of domestic capabilities to produce substrate-like printed circuit boards (PCB) containing ultra-high-density interconnect (UHDI) features including traces in the 20 to 25 micron range. These finer traces, or copper lines, are needed for advanced designs that can integrate the latest microchips while reducing size and weight. For purposes of this effort UHDI and Substrate-Like PCB (SLP) are used interchangeably.
UHDI/SLP Fabrication has been identified as an area where the supply and demand sides of the market are at an impasse, and require government intervention to stimulate demand by generating supply – that is, proactively creating a new industrial base capability that the market is not creating on its own. Your input will assist us in developing a robust plan to bridge this gap.
Responses will be anonymized. Please feel free to answer as many or as few questions as you wish. There are no mandatory questions.