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Microelectronics Commons Awareness Day

9 November 2022

1:00 pm – 2:30 pm ET

The Microelectronics Commons is a first-of-its-kind solution to empower commercial leaders to guide the DoD's efforts in microelectronics development. With the creation of regional technology hubs, each focusing on one or multiple key technology areas, Microelectronics Commons is closing the gap between research ideas and realization of those ideas.
1.Please provide your contact information.(Required.)
2.Please indicate your organization type. For context: 

The term “non-traditional defense contractor”, with respect to a procurement or with respect to a transaction authorized under section 4021 or 4022 of this title, means an entity that is not currently performing and has not performed, for at least the one-year period preceding the solicitation of sources by the Department of Defense for the procurement or transaction, any contract or subcontract for the Department of Defense that is subject to full coverage under the cost accounting standards (CAS) prescribed pursuant to section 1502 of title 41 and the regulations implementing such section.

A “traditional” defense contractor has contract/s and/or subcontract/s that are subject to the Cost Accounting Standards (CAS). These are referred to as CAS-covered contracts. CAS-covered contracts are typically large, multi-million/multi-billion dollar contracts for weapons systems, aircraft, ships, space systems, IT business systems, etc.(Required.)
3.Please select your Microelectronics Commons areas of interest. (Select all that apply)(Required.)
4.Does your organization have "core" capabilities? For context...

Core Facilities (Cores) are entities with the capabilities that are required to demonstrate prototypes with the volume and characteristics required to ensure reduced risk for full manufacturing production. They provide Hubs with access to repeatable processes, back-end manufacturing/integration and full flow-fabrication (i.e., Cores have scalable capacity beyond what the regional Hubs will be required to provide).

Core facilities will provide access to ≥200-mm tooling for prototyping silicon compatible technologies and/or ≥100-mm tooling for compound semiconductor technologies.(Required.)
5.Are you participating as a Hub? (Required.)
6.Please indicate if you'd like to be notified of future Microelectronics Commons events planned through the end of the year. (Select all that apply)(Required.)
7.May we share your contact information with event participants?(Required.)
8.Do you have any questions for the Microelectronics Commons briefing team?