iNEMI Survey on Methodologies used for Qualifying New Package Technologies and Materials

iNEMI is conducting this industry-wide survey to understand what package qualification methodologies are used today and how users' requirements are obtained to ensure that a robust qualification plan is generated. 

The results of this survey will be used to identify gaps in qualification methodologies for new package technologies and materials as well as identify any trends. This project will then propose ways to address those gaps as well as gather and document the industry best practices for the development and qualification of new packaging technologies and materials.

We ask your participation in this survey, and thank you in advance for your input. Only aggregated data will be reported from this survey. No personal or company data will be included in the final report.

If you have any question about this survey, please contact M. Tsuriya (m.tsuriya@inemi.org)

Background:

Today, new package technologies are qualified using procedures and test conditions based on previous experience with the most similar technology previously qualified.  However, stress test based and even knowledge based qualification strategies by themselves may not be fully effective when new package technology and materials are to be qualified.

While previous experience is important when developing a qualification plan, relying too much on experience may result in overlooking new failure modes and/or new wear out mechanisms.  Similarly, performing the same test methods as in the past may not identify all reliability and quality risks of the new package technology/material.

Fewer device suppliers still maintain their own assembly locations or perform their own package development, while device suppliers increasingly rely on OSAT (Outsourced Assembly & Test) suppliers for the development and qualification of new package technologies and materials that they plan to use.  This trend introduces the concern that the input and requirements of all potential end users may not be included in the generation of the qualification plan.  If only the first few customers of the new package technology are included in the generation of the qualification plan, the plan may not have a complete understanding of the assembly processes, application environments, and use conditions of all potential end-users.