Introduction

Dear respondent,

F4E is gathering information on Uniaxial Diffusion Bonding (i.e. does not include hipping) of complex components. This survey is made in order to support on-going design for manufacture activities within the ICRH Antenna system, which will result in future procurement activities.
 
Thank you for your participation.
F4E Market Intelligence Group & ANTENNAS Project Team

This Market Survey (MS) is carried out for information purposes in accordance with Fusion for Energy’s Financial Regulation and Implementing Rules. Participants/respondents to this MS acknowledge that this MS imposes no obligation on Fusion for Energy to future procurement activities. Submission of answers to the MS does not imply any right to further involvement in any procedure launched by Fusion for Energy.
Any personal data shall be processed by Fusion for Energy pursuant to Regulation (EC) No 45/2001 on the protection of individuals with regard to the processing of personal data by the European Union institutions and bodies and on the free movements of such data.
 The answers and any information gathered through this MS will not be communicated to any third party without the explicit consent of respondents.
For more details please contact industryportal-info@f4e.europa.eu

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* 1. Please fill in the following matrix for readiness of Diffusion Bonding (SS=Stainless Steel) by using the following answer code:
Y = can be readily bonded with resulting mechanical properties comparable to those of the parent materials
(Y) = can be bonded with resulting mechanical properties significantly inferior to those of the parent materials
N = cannot be bonded (no bond or result in trivial mechanical properties)
?  = I do not know

  SS 316 generic SS 316L(N) Inconel 718 Inconel 625 SS 660 SS 304
SS 316 generic
SS 316L(N)
Inconel 718
Inconel 625
SS 660
SS 304

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* 2. Can a layer of ceramic be bonded between the above materials (assuming equal parent materials)?

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* 3. According to the figure below, is it possible to;
- bond two parts (part 1 and 2), then
- machine a new bond face along a plane incident to the first plane (i.e. not parallel), and
- bond a further part (part 3) to the existing assembly?
What effects will the second bonding process have on the first joint?
(Please assume that suitable jigs and fixtures can be used in order to correctly orient and support the parts.)

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* 4. What is the maximum size of the component that the Diffusion Bonding oven can accept?

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* 5. What is the maximum contact area to be bonded that the oven can accept for each of the above materials (assuming equal parent materials)?

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* 6. What are the requirements on the bond face for:

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* 7. According to the following image, if (e.g. cooling) channels are machined into the surface(s) to be bonded, what are the limitations on the minimum and maximum size of the channels, including their aspect ratio?

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* 8. According to the following image, in the presence of cavities embedded in the parts (e.g. cooling channels), what is the minimum wall thickness between the cavities?

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* 9. According to the following image, in the presence of cavities embedded in the parts (e.g. cooling channels), what distortion within the part and hence within the cavities can one expect to be caused by the diffusion bonding process? E.g. by how much could the axis of a cooling channel shift, or the surface of the cooling channel itself, in case a complex 3D network of cooling channels was being manufactured through successive diffusion bonding of pre-machined parts?

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* 10. Please indicate recommended reference documentation (specific standards, or an established textbook, etc...) to guide the design of complex diffusion bonding structures?

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* 11. According to the following image, in the presence of cavities embedded in the parts (e.g. cooling channels), what maximum displacement – due to distortion within the part caused by the diffusion bonding process – can one expect the embedded cavities to experience with respect to the external surfaces of the part?

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* 12. Is there a rule of thumb for the design of parts to be diffusion bonded regarding the distribution of embedded cavities or voids (e.g. steel/void ratio, directionality of cavities, etc.)?

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* 13. Please indicate the name of your company

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* 14. Please indicate your name and surname

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* 15. Please indicate your email

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Thank you for your participation.
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