IMAPS DPC 2023 Student Competition Submission

IMAPS DPC 2023 Student Competition Application

Calling on student teams to expand the possibilities of package design using additive manufacturing. As part of this design challenge you will be asked to design, build, and validate an additively manufactured package to house a controller circuit for a remote controlled or autonomous vehicle, such as a Roomba. The package will be designed to meet a series of electronic and packaging metrics of performance, size, weight, and reliability, as shown below. All packaging components, except the devices, should be additively manufactured.

After an initial registration period, you will be sent detailed scoring criteria and manufacturing constraints. You will need first to prepare a white paper that justifies your design, materials selection, and qualification test plan. This can be done with preliminary multi-physics modeling. The top three papers will be selected for protoype manufacture and testing. These top teams will be supported such that one member can travel to the IMAPS Symposium in San Diego in March, where they will defend their design using the actual prototype and a video presentation in front of industry leaders. From those oral presentations, the champion will be crowned! Good luck!

Metrics:

• The packaged circuit not the full product must be less than 15 cm3 and less than 0.5 kg in weight.

• No breadboarding of circuit – must be actual functioning package

• Must withstand short exposure (24 hrs) to high temperature (150⁰C), and to humidity (60⁰C, 85%RH)

• Must withstand a drop of 1 m

• Must avoid obstacles on a track

Judging Criteria:

• Size and Weight of Packaged Circuit

• Successful Completion of the Metrics

• Time needed to successfully complete the course

Timeline:

• Call for Papers and Registration: December 16, 2022

• Design Phase and White Paper: January 13, 2023

• White Paper Judging: January 16-27, 2023

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