ALPHA ASSEMBLY SOLUTIONS

VOID REDUCTION SOLUTIONS SURVEY

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* 1. Company Contact Information

Name

Company

Address

Address 2

City/Town

State/Province

ZIP/Postal Code

Country

Email Address

Phone Number

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* 2. Primary Contact Job Function

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* 3. Which of the markets is driving you to reduce voids? (mark all that apply)

Automotive

Telecommunications

Mobile Device

Industrial

Other (please specify)

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* 4. On a scale of 1-10, how would you rank voiding as a day-to-day issue in your production process? (10 is highest severity)

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* 5. What is the primary reason for seeking a void reduction? (mark all that apply)

Customer's requirement

Existing field failures thought to be caused by excessive voiding

Internal specification

Component manufacturer's void requirement

IPC or other standards committee requirement

Other (please specify)

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* 6. Approximately what percentage of production PCBs are sent for rework (or discarded) due to voiding?

<1%

<5%

<10%

Other (please specify)

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* 7. Which component packages exhibit the highest voiding in your process (mark all that apply)?

BGA

LGA

BTC

LDMos Transistor

D2PAK

Other (please specify)

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* 8. For a given component, approximately what target level of total voids (%) are you trying to achieve?

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* 9. What is your level of urgency for a void reduction solution? (mark all that apply)

30 Days

90 Days

180 Days

Other (please specify)

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* 10. In an effort to reduce voiding, on a scale of 1-10, rank your interest level in receiving an in-person audit & process optimization recommendation (material selection, stencil design, reflow parameters, PCB Pad design) from an Alpha application expert. (10 being most interested)

Question Title

* 1. Company Contact Information

Question Title

* 2. Primary Contact Job Function

Question Title

* 3. Which of the markets is driving you to reduce voids? (mark all that apply)

Question Title

* 4. On a scale of 1-10, how would you rank voiding as a day-to-day issue in your production process? (10 is highest severity)

Question Title

* 5. What is the primary reason for seeking a void reduction? (mark all that apply)

Question Title

* 6. Approximately what percentage of production PCBs are sent for rework (or discarded) due to voiding?

Question Title

* 7. Which component packages exhibit the highest voiding in your process (mark all that apply)?

Question Title

* 8. For a given component, approximately what target level of total voids (%) are you trying to achieve?

Question Title

* 9. What is your level of urgency for a void reduction solution? (mark all that apply)

Question Title

* 10. In an effort to reduce voiding, on a scale of 1-10, rank your interest level in receiving an in-person audit & process optimization recommendation (material selection, stencil design, reflow parameters, PCB Pad design) from an Alpha application expert. (10 being most interested)

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* 11. On a scale of 1-10, how would you rank your willingness to pay for the service described in the previous question? (10 being most willing)