Help Improve SEMI E72 - SPECIFICATION AND GUIDE FOR EQUIPMENT FOOTPRINT, HEIGHT, AND WEIGHT

This survey is open to IC device manufacturers, suppliers of production equipment, related Fab infrastructure suppliers, and other stakeholders, for their inputs on SEMI E72 and its potential improvement points.

Please take a few minutes to complete this survey and help guide the direction the outcome of this standard.

The results of this survey will be reported at the SEMI E72 Revision TF.

Please note that raw data of this survey will be handled by the SEMI Staff. Unless otherwise indicated by the responder, identity of the responder will be removed before the SEMI Staff forwards the survey responses to the TF for aggregations and analysis.

PLEASE SUBMIT YOUR SURVEY RESPONSES by Monday, April 17, 2023.

Question Title

* Do you believe that an update to SEMI E72 is needed?

Yes

I don't know

Comments or arguments for your choice:

Question Title

* Please choose the type of business of your company. If one or more than one type is applicable for your company, choose the one most relevant to your job description.

IC Device Manufacturer

Production Equipment Supplier

AMHS Supplier

Other Supplier

Other (e.g., consultant)