1. Techie Camp Letter of Recommendation

With support from the Leonard Gelfand STEM Center at Case Western Reserve University (CWRU), Cognizant, and the Fowler Family Foundation, TECH CORPS will implement its Techie Camp® program with 160 students from Breakthrough Schools, Cleveland Heights/University Heights Schools, Cleveland Metropolitan School District (CMSD), East Cleveland Schools, Euclid, South Euclid-Lyndhurst Schools and Warrensville Heights Schools during the summer of 2017.

Techie Camp is a full-day, week-long summer experience designed specifically for elementary and middle school students. The goal of Techie Camp is to engage students in activities that can stimulate a deeper interest in technology as well as provide opportunities for them to express their imaginations.

Each camp is comprised of 20 students and lead by two TECH CORPS Instructors.
Families will be responsible for transportation and lunch/two snacks/beverages.
Camps will be held at Case Western Reserve University.
Please contact acrosby@techcorps.org or 216-315-8240 with any questions


THIS OPPORTUNITY IS ONLY OPEN TO STUDENTS WHO MEET BOTH OF THE FOLLOWING REQUIREMENTS:

-Attend Cleveland Metropolitan, Breakthrough Schools, East Cleveland, Cleveland Heights-University Heights, Euclid City, South Euclid-Lyndhurst, or Warrensville Heights City Schools
-Will be enrolled in the 3rd-5th or 6th-8th grade in the Fall of 2017

Student Selection Process:

Students interested in being selected to participate will need to complete the full application before the Friday, April 21, 2017 deadline. Up to 20 students will be selected for each camp based on their application (10 points), short answer questions (60 points) and letter of recommendation (30 points). Please note that incomplete applications, including separate letter of recommendation, will NOT be considered. Students will beginning the week of May 1st.

One of your students has applied for Techie Camp and is requesting a letter of recommendation from you on her behalf. Please answer the following questions to complete the student's application package. 

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